7th iDECON

Dear All Respected Researchers, Academicians, Expertise, Engineer, Designer and Postgraduates Students,

CALL FOR PAPERS

7^th International Conference on Design & Concurrent Engineering 2018 (7^thiDECON)

7^thiDECON : Industry 4.0 – Manufacturing Excellence and Sustainability

The 7^thiDECON organized by Faculty of Manufacturing Engineering, Universiti Teknikal Malaysia Melaka (UTeM) will take place on:

17^th – 18^th September 2018

Riverside Majestic Hotel in Kuching, Sarawak, Malaysia

All accepted and registered papers will be published in SCOPUS INDEXED journals by Universiti Teknikal Malaysia Melaka (UTeM):

Journal of Advanced Manufacturing Technology

(JAMT) (ISSN: 1985-3157; e-ISSN: 2289-8107)

OR

Journal of Telecommunication, Electronic and Computer Engineering (JTEC) (ISSN: 2180-1843; e-ISSN: 2289-8131)

JAMT and JTEC are currently abstracted and indexed by Scopus, Index Copernicus International (ICV 2016: 70.57), Google Scholar, Genamics, Ulrich’s Periodicals, Worldcat, MYCite and MYJurnal.

Author are invited to submit original, unpublished papers on all aspects including but not limited to the following technical areas:

JAMT Theme and Scope: Industrial 4.0 in Manufacturing; Product Innovation; Green Design & Sustainability; Sustainable Materials & Design; Composite Product Design & Advanced Materials; Design for Environment and Sustainability; Design for Manufacturing & Assembly; CAD/CAM/CAE; Reliability in Design; Ergonomics in Design; Virtual Engineering; Concurrent Engineering; Rapid Prototyping; Reverse Engineering; Ergonomics in Design; Quality Engineering and Management; Manufacturing Process; Nanomaterials and Nanotechnology;Materials Science & Engineering; Design for Automation & Intelligent Systems; Design for Mechatronics Systems; Industrial Automation and Robotics; Features Based Technology;Emotion Engineering; Technology and Design; Automotive Engineering and Energy; Technology Management; Supply Chain Management; Logistics; Materials Handling; Warehousing;and Global Manufacturing Management.

Visit: http://journal.utem.edu.my/index.php/jamt/index for paper template and guidelines of JAMT. Manuscript should be no more than 12 pages in length inclusive tables, figures and illustrations.

Journal of Advanced Manufacturing Technology (JAMT) journal.utem.edu.my Journal of Advanced Manufacturing Technology ISSN: 1985-3157 e-ISSN: 2289-8107. Journal of Advanced Manufacturing Technology (JAMT) is a biannual peer reviewed …

 

JTEC Theme and Scope: Telecommunications, Electronics and Computer Engineering; Software Engineering; Consumer Electronics; Electronic Design and Devices; Optoelectronics;Broadband and Multimedia System; Computer and Embedded System; Nano Materials Technology; and Energy Harvesting.

Visit: http://journal.utem.edu.my/index.php/jtec/index for paper template and guidelines of JTEC. Manuscript should be no more than 10 pages in length inclusive tables, figures and illustrations.

Journal of Telecommunication, Electronic and Computer … journal.utem.edu.my Journal of Telecommunication, Electronic and Computer Engineering (JTEC) ISSN: 2180-1843. eISSN: 2289-8131. JTEC is a peer-reviewed journal by Faculty of Electronic …

 

7^thiDECON is now accepting full manuscript submissions, EXCEPT for the review paper. Prospective authors are invited to submit their paper to EASY CHAIR:https://easychair.org/conferences/?conf=idecon2018

Important Dates & Conference Fees:

7thiDECON  Important Dates
Full Paper Submission	Dateline: 30th April 2018
Notification of Acceptance	30th June 2018
Authors Registration Dateline	31st July 2018
Conference Day	17th – 18th September 2018

 

7thiDECON  Conference Fees*	Local and International Participant (in MYR)
Full Fees with Paper	1500
Second Paper Onwards**	1300
Audience / Participant without Paper	1000

*The Conference fee includes conference receptions, lunches and snacks during the conference.

**For submission more than one (1) paper as the same presenting author.

 

Conference details for 7^thiDECON can be reach at: https://idecon2018.utem.edu.my and please do not hesitate to email us at idecon@utem.edu.my for any further assistance and enquiries.

We welcomed your participation in 7^thiDECON and see you all in Kuching, Sarawak. Where Adventure Lives!!!

 

Thank You & Best Wishes

7^thiDECON Organizing Committee

# Kindly help us to disseminate this 7^thiDECON CFP email to your colleagues, researchers and post-graduates students.