Assalamualaikum w.b.t dan Salam Sejahtera

Dear All Respected Researchers, Academicians, Expertise, Engineer, Designer and Postgraduates Students,

CALL FOR PAPERS

7^th International Conference on Design & Concurrent Engineering 2018 (7^thiDECON)

7^thiDECON : Industry 4.0 – Manufacturing Excellence and Sustainability

The 7^thiDECON organized by Faculty of Manufacturing Engineering, Universiti Teknikal Malaysia Melaka (UTeM) will take place on:

17^th – 18^th September 2018

Riverside Majestic Hotel in Kuching, Sarawak, Malaysia

All accepted and registered papers will be published in SCOPUS INDEXED journals by Universiti Teknikal Malaysia Melaka (UTeM):

Journal of Advanced Manufacturing Technology

(JAMT) (ISSN: 1985-3157; e-ISSN: 2289-8107)

OR

Journal of Telecommunication, Electronic and Computer Engineering (JTEC) (ISSN: 2180-1843; e-ISSN: 2289-8131)

JAMT and JTEC are currently abstracted and indexed by Scopus, Index Copernicus International (ICV 2016: 70.57), Google Scholar, Genamics, Ulrich’s Periodicals, Worldcat, MYCite and MYJurnal.

Author are invited to submit original, unpublished papers on all aspects including but not limited to the following technical areas:

JAMT Theme and Scope: Industrial 4.0 in Manufacturing; Product Innovation; Green Design & Sustainability; Sustainable Materials & Design; Composite Product Design & Advanced Materials; Design for Environment and Sustainability; Design for Manufacturing & Assembly; CAD/CAM/CAE; Reliability in Design; Ergonomics in Design; Virtual Engineering; Concurrent Engineering; Rapid Prototyping; Reverse Engineering; Ergonomics in Design; Quality Engineering and Management; Manufacturing Process; Nanomaterials and Nanotechnology;Materials Science & Engineering; Design for Automation & Intelligent Systems; Design for Mechatronics Systems; Industrial Automation and Robotics; Features Based Technology;Emotion Engineering; Technology and Design; Automotive Engineering and Energy; Technology Management; Supply Chain Management; Logistics; Materials Handling; Warehousing;and Global Manufacturing Management.

Visit: http://journal.utem.edu.my/index.php/jamt/index for paper template and guidelines of JAMT. Manuscript should be no more than 12 pages in length inclusive tables, figures and illustrations.

JTEC Theme and Scope: Telecommunications, Electronics and Computer Engineering; Software Engineering; Consumer Electronics; Electronic Design and Devices; Optoelectronics;Broadband and Multimedia System; Computer and Embedded System; Nano Materials Technology; and Energy Harvesting.

Visit: http://journal.utem.edu.my/index.php/jtec/index for paper template and guidelines of JTEC. Manuscript should be no more than 10 pages in length inclusive tables, figures and illustrations.

7^thiDECON is now accepting full manuscript submissions, EXCEPT for the review paper. Prospective authors are invited to submit their paper to EASY CHAIR:https://easychair.org/conferences/?conf=idecon2018

Important Dates & Conference Fees:

*The Conference fee includes conference receptions, lunches and snacks during the conference.

**For submission more than one (1) paper as the same presenting author.

Conference details for 7^thiDECON can be reach at: https://idecon2018.utem.edu.my and please do not hesitate to email us at idecon@utem.edu.my for any further assistance and enquiries.

We welcomed your participation in 7^thiDECON and see you all in Kuching, Sarawak. Where Adventure Lives!!!

Thank You & Best Wishes

7^thiDECON Organizing Committee

# Kindly help us to disseminate this 7^thiDECON CFP email to your colleagues, researchers and post-graduates students.

I’M VOLUNTEER? YES! APPLY NOW! Are you an outgoing and enthusiastic person, with a passion for environment? If you are, we offer you an opportunity to volunteer with us where you will be making a difference and contributing to a good cause. Let’s work together with us! https://goo.gl/forms/5IzzQ7FSPRP6LWjE3