{"id":3195,"date":"2018-02-20T03:23:38","date_gmt":"2018-02-20T03:23:38","guid":{"rendered":"http:\/\/people.utm.my\/wanfahminfaiz\/?p=3195"},"modified":"2018-02-20T03:23:38","modified_gmt":"2018-02-20T03:23:38","slug":"7th-idecon","status":"publish","type":"post","link":"https:\/\/people.utm.my\/wanfahminfaiz\/7th-idecon\/","title":{"rendered":"7th iDECON"},"content":{"rendered":"<p style=\"font-weight: 400\"><em>Dear All Respected Researchers, Academicians, Expertise, Engineer, Designer and Postgraduates Students,<\/em><\/p>\n<p style=\"font-weight: 400\"><strong>CALL FOR PAPERS<\/strong><\/p>\n<p style=\"font-weight: 400\"><strong><em>7<sup>th<\/sup>\u00a0International Conference on Design &amp; Concurrent Engineering 2018 (7<sup>th<\/sup>iDECON)<\/em><\/strong><\/p>\n<p style=\"font-weight: 400\"><strong><em>7<sup>th<\/sup>iDECON : Industry 4.0 \u2013 Manufacturing Excellence and Sustainability<\/em><\/strong><\/p>\n<p style=\"font-weight: 400\">\n<p style=\"font-weight: 400\">The\u00a0<strong><em>7<sup>th<\/sup>iDECON<\/em><\/strong>\u00a0organized by\u00a0<em>Faculty of Manufacturing Engineering, Universiti Teknikal Malaysia Melaka (UTeM)<\/em>\u00a0will take place on:<\/p>\n<p style=\"font-weight: 400\"><strong><em>17<sup>th<\/sup>\u00a0\u2013 18<sup>th<\/sup>\u00a0September 2018<\/em><\/strong><\/p>\n<p style=\"font-weight: 400\"><strong><em>Riverside Majestic Hotel in Kuching, Sarawak, Malaysia<\/em><\/strong><\/p>\n<p style=\"font-weight: 400\">All accepted and registered papers will be published in\u00a0<strong>SCOPUS INDEXED<\/strong>\u00a0journals by\u00a0<strong><em>Universiti Teknikal Malaysia Melaka (UTeM)<\/em><\/strong>:<\/p>\n<p style=\"font-weight: 400\"><strong><em><u>Journal of Advanced Manufacturing Technology<\/u><\/em><\/strong><\/p>\n<p style=\"font-weight: 400\"><strong><em><u>(JAMT)<\/u><\/em><\/strong><em>\u00a0(ISSN: 1985-3157; e-ISSN: 2289-8107)<\/em><\/p>\n<p style=\"font-weight: 400\">OR<\/p>\n<p style=\"font-weight: 400\"><strong><em><u>Journal of Telecommunication, Electronic and Computer Engineering (JTEC)<\/u><\/em><\/strong><em>\u00a0(ISSN: 2180-1843; e-ISSN: 2289-8131)<\/em><\/p>\n<p style=\"font-weight: 400\">\n<p style=\"font-weight: 400\"><em><u>JAMT<\/u><\/em><em>\u00a0and\u00a0<u>JTEC<\/u>\u00a0are currently abstracted and indexed by Scopus, Index Copernicus International (ICV 2016: 70.57), Google Scholar, Genamics, Ulrich\u2019s Periodicals, Worldcat, MYCite and MYJurnal.<\/em><\/p>\n<p style=\"font-weight: 400\"><strong><em>Author are invited to submit original, unpublished papers on all aspects including but not limited to the following technical areas:<\/em><\/strong><\/p>\n<p style=\"font-weight: 400\">\n<p style=\"font-weight: 400\"><strong>JAMT Theme and Scope:<\/strong>\u00a0<u>I<\/u><u>ndustrial 4.0 in Manufacturing<\/u>;\u00a0<u>Product Innovation<\/u>;\u00a0<u>Green Design &amp; Sustainability<\/u>;\u00a0<u>Sustainable Materials &amp; Design<\/u>;\u00a0<u>Composite Product Design &amp; Advanced Materials<\/u>;\u00a0<u>Design for Environment and Sustainability<\/u>;\u00a0<u>Design for Manufacturing &amp; Assembly<\/u>;\u00a0<u>CAD\/CAM\/CAE<\/u>;\u00a0<u>Reliability in Design<\/u>;\u00a0<u>Ergonomics in Design<\/u>;\u00a0<u>Virtual Engineering<\/u>;\u00a0<u>Concurrent Engineering<\/u>;\u00a0<u>Rapid Prototyping<\/u>;\u00a0<u>Reverse Engineering<\/u>;\u00a0<u>Ergonomics in Design<\/u>;\u00a0<u>Quality Engineering and Management<\/u>;\u00a0<u>Manufacturing Process<\/u>;\u00a0<u>Nanomaterials and Nanotechnology<\/u>;<u>Materials Science &amp; Engineering<\/u>;\u00a0<u>Design for Automation &amp; Intelligent Systems<\/u>;\u00a0<u>Design for Mechatronics Systems<\/u>;<u>\u00a0Industrial Automation and Robotics<\/u>;\u00a0<u>Features Based Technology<\/u>;<u>Emotion Engineering<\/u>;\u00a0<u>Technology and Design<\/u>;\u00a0<u>Automotive Engineering and Energy<\/u>;\u00a0<u>Technology Management<\/u>;\u00a0<u>Supply Chain Management; Logistics<\/u>;\u00a0<u>Materials Handling<\/u>;\u00a0<u>Warehousing;<\/u>and\u00a0<u>Global Manufacturing Management.<\/u><\/p>\n<p style=\"font-weight: 400\"><em>Visit:\u00a0<\/em><a href=\"http:\/\/journal.utem.edu.my\/index.php\/jamt\/index\"><em>http:\/\/journal.utem.edu.my\/index.php\/jamt\/index<\/em><\/a><em>\u00a0for paper template and guidelines of JAMT. Manuscript should be\u00a0<strong>no more than\u00a0<u>12 pages<\/u><\/strong>\u00a0in length inclusive tables, figures and illustrations.<\/em><\/p>\n<table>\n<tbody>\n<tr>\n<td colspan=\"2\">\n<p style=\"font-weight: 400\"><a href=\"http:\/\/journal.utem.edu.my\/index.php\/jamt\/index\">Journal of Advanced Manufacturing Technology (JAMT)<\/a><\/p>\n<p style=\"font-weight: 400\"><a href=\"http:\/\/journal.utem.edu.my\/\">journal.utem.edu.my<\/a><\/p>\n<p style=\"font-weight: 400\">Journal of Advanced Manufacturing Technology ISSN: 1985-3157 e-ISSN: 2289-8107. Journal of Advanced Manufacturing Technology (JAMT) is a biannual peer reviewed &#8230;<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>&nbsp;<\/p>\n<p style=\"font-weight: 400\"><strong>JTEC Theme and Scope<\/strong>:\u00a0<u>Telecommunications, Electronics and Computer Engineering<\/u>;\u00a0<u>Software Engineering<\/u>;\u00a0<u>Consumer Electronics<\/u>;\u00a0<u>Electronic Design and Devices<\/u>;\u00a0<u>Optoelectronics<\/u>;<u>Broadband and Multimedia System<\/u>;\u00a0<u>Computer and Embedded System<\/u>;\u00a0<u>Nano Materials Technology<\/u>; and\u00a0<u>Energy Harvesting<\/u>.<\/p>\n<p style=\"font-weight: 400\"><em>Visit:\u00a0<\/em><a href=\"http:\/\/journal.utem.edu.my\/index.php\/jtec\/index\"><em>http:\/\/journal.utem.edu.my\/index.php\/jtec\/index<\/em><\/a><em>\u00a0for paper template and guidelines of JTEC. Manuscript should be\u00a0<strong>no more than\u00a0<u>10 pages<\/u><\/strong>\u00a0in length inclusive tables, figures and illustrations.<\/em><\/p>\n<table>\n<tbody>\n<tr>\n<td colspan=\"2\">\n<p style=\"font-weight: 400\"><a href=\"http:\/\/journal.utem.edu.my\/index.php\/jtec\/index\">Journal of Telecommunication, Electronic and Computer &#8230;<\/a><\/p>\n<p style=\"font-weight: 400\"><a href=\"http:\/\/journal.utem.edu.my\/\">journal.utem.edu.my<\/a><\/p>\n<p style=\"font-weight: 400\">Journal of Telecommunication, Electronic and Computer Engineering (JTEC) ISSN: 2180-1843. eISSN: 2289-8131. JTEC is a peer-reviewed journal by Faculty of Electronic &#8230;<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>&nbsp;<\/p>\n<p style=\"font-weight: 400\"><strong><em>7<sup>th<\/sup>iDECON<\/em><\/strong>\u00a0is now accepting full manuscript submissions,\u00a0<strong><u>EXCEPT<\/u><\/strong>\u00a0for the review paper. Prospective authors are invited to submit their paper to\u00a0<strong><em><u>EASY CHAIR:<\/u><\/em><\/strong><a href=\"https:\/\/easychair.org\/conferences\/?conf=idecon2018\">https:\/\/easychair.org\/conferences\/?conf=idecon2018<\/a><\/p>\n<p style=\"font-weight: 400\"><strong>Important Dates &amp; Conference Fees:<\/strong><\/p>\n<table>\n<tbody>\n<tr>\n<td colspan=\"2\" width=\"538\"><strong><em>7<sup>th<\/sup>iDECON<\/em><\/strong><strong>\u00a0\u00a0Important Dates<\/strong><\/td>\n<\/tr>\n<tr>\n<td width=\"274\"><strong>Full Paper Submission<\/strong><\/td>\n<td width=\"265\"><strong>Dateline: 30<sup>th<\/sup>\u00a0April 2018<\/strong><\/td>\n<\/tr>\n<tr>\n<td width=\"274\"><strong>Notification of Acceptance<\/strong><\/td>\n<td width=\"265\"><strong>30<sup>th<\/sup>\u00a0June 2018<\/strong><\/td>\n<\/tr>\n<tr>\n<td width=\"274\"><strong>Authors Registration Dateline<\/strong><\/td>\n<td width=\"265\"><strong>31<sup>st\u00a0<\/sup>July 2018<\/strong><\/td>\n<\/tr>\n<tr>\n<td width=\"274\"><strong>Conference Day<\/strong><\/td>\n<td width=\"265\"><strong>17<sup>th<\/sup>\u00a0\u2013 18<sup>th<\/sup>\u00a0September 2018<\/strong><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p style=\"font-weight: 400\"><strong><em>\u00a0<\/em><\/strong><\/p>\n<table>\n<tbody>\n<tr>\n<td width=\"340\"><strong><em>7<sup>th<\/sup>iDECON<\/em><\/strong><strong>\u00a0\u00a0Conference Fees*<\/strong><\/td>\n<td width=\"236\"><strong>Local and International Participant (in MYR)<\/strong><\/td>\n<\/tr>\n<tr>\n<td width=\"340\"><strong>Full Fees with Paper<\/strong><\/td>\n<td width=\"236\"><strong>1500<\/strong><\/td>\n<\/tr>\n<tr>\n<td width=\"340\"><strong>Second Paper Onwards**<\/strong><\/td>\n<td width=\"236\"><strong>1300<\/strong><\/td>\n<\/tr>\n<tr>\n<td width=\"340\"><strong>Audience \/ Participant without Paper<\/strong><\/td>\n<td width=\"236\"><strong>1000<\/strong><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p style=\"font-weight: 400\"><em>*The Conference fee includes conference receptions, lunches and snacks during the conference.<\/em><\/p>\n<p style=\"font-weight: 400\"><em>**For submission more than one (1) paper as the same presenting author.<\/em><\/p>\n<p style=\"font-weight: 400\"><em>\u00a0<\/em><\/p>\n<p style=\"font-weight: 400\">Conference details for\u00a0<strong><em>7<sup>th<\/sup>iDECON\u00a0<\/em><\/strong>can be reach at:\u00a0<a href=\"https:\/\/idecon2018.utem.edu.my\/\">https:\/\/idecon2018.utem.edu.my<\/a>\u00a0and please do not hesitate to email us at\u00a0idecon@utem.edu.my\u00a0for any further assistance and enquiries.<\/p>\n<p style=\"font-weight: 400\">\n<p style=\"font-weight: 400\">We welcomed your participation in<strong><em>\u00a0<\/em><\/strong><strong><em>7<sup>th<\/sup>iDECON<\/em><\/strong>\u00a0and see you all in\u00a0<strong>Kuching, Sarawak<\/strong>.\u00a0<strong><em>Where Adventure Lives!!!<\/em><\/strong><\/p>\n<p style=\"font-weight: 400\"><strong><em>\u00a0<\/em><\/strong><\/p>\n<p style=\"font-weight: 400\"><em>Thank You &amp; Best Wishes<\/em><\/p>\n<p style=\"font-weight: 400\"><strong><em>7<sup>th<\/sup>iDECON<\/em><\/strong><strong>\u00a0Organizing Committee<\/strong><\/p>\n<p style=\"font-weight: 400\"><strong><em># Kindly help us to disseminate this 7<sup>th<\/sup>iDECON CFP email to your colleagues, researchers and post-graduates students.<\/em><\/strong><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Dear All Respected Researchers, Academicians, Expertise, Engineer, Designer and Postgraduates Students, CALL FOR PAPERS 7th\u00a0International Conference on Design &amp; Concurrent Engineering 2018 (7thiDECON) 7thiDECON : Industry 4.0 \u2013 Manufacturing Excellence and Sustainability The\u00a07thiDECON\u00a0organized by\u00a0Faculty of Manufacturing Engineering, Universiti Teknikal Malaysia Melaka (UTeM)\u00a0will take place on: 17th\u00a0\u2013 18th\u00a0September 2018 Riverside Majestic Hotel in Kuching, Sarawak, Malaysia [&hellip;]<\/p>\n","protected":false},"author":13826,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[12,46,45],"tags":[],"class_list":["post-3195","post","type-post","status-publish","format-standard","hentry","category-utm","category-utm-events","category-utm-news","entry"],"_links":{"self":[{"href":"https:\/\/people.utm.my\/wanfahminfaiz\/wp-json\/wp\/v2\/posts\/3195","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/people.utm.my\/wanfahminfaiz\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/people.utm.my\/wanfahminfaiz\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/people.utm.my\/wanfahminfaiz\/wp-json\/wp\/v2\/users\/13826"}],"replies":[{"embeddable":true,"href":"https:\/\/people.utm.my\/wanfahminfaiz\/wp-json\/wp\/v2\/comments?post=3195"}],"version-history":[{"count":1,"href":"https:\/\/people.utm.my\/wanfahminfaiz\/wp-json\/wp\/v2\/posts\/3195\/revisions"}],"predecessor-version":[{"id":3196,"href":"https:\/\/people.utm.my\/wanfahminfaiz\/wp-json\/wp\/v2\/posts\/3195\/revisions\/3196"}],"wp:attachment":[{"href":"https:\/\/people.utm.my\/wanfahminfaiz\/wp-json\/wp\/v2\/media?parent=3195"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/people.utm.my\/wanfahminfaiz\/wp-json\/wp\/v2\/categories?post=3195"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/people.utm.my\/wanfahminfaiz\/wp-json\/wp\/v2\/tags?post=3195"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}