Archives for November 2015

ETFA 2016

                              ETFA 2016
21th IEEE International Conference on Emerging Technologies & Factory Automation
                            Berlin, Germany
                          6-9 September 2016
                   Web site:
The aim of the ETFA 2016 conference is to bring together researchers and practitioners from the industry and academia and provide them with a platform to report on recent advances and developments in the newly emerging areas of technology, as well as actual and potential applications to industrial and factory automation.
T1. Information Technology in Automation
T2. Industrial Communication Systems
T3. Real-Time and (Networked) Embedded Systems [RTNES]
T4. Automated Manufacturing Systems
T5. Industrial Control
T6. Computer Vision, Computational Intelligence, and Modern Heuristics in Automation
T7. Intelligent Robots & Systems
T8. Intelligent Sensors, Sensor Networks, and Information Processing
T9. Information and Communication Technology in Energy System
for details of the submission areas topics see:
SOLICITED PAPERS: Research papers reporting on new developments in technological sciences. Industry and development papers
reporting on actual developments of technology, products, systems and solutions. Tutorial and survey papers. Work-in-progress
papers. In addition, ETFA 2016 solicits special session proposals to stimulate in-depth discussions in special areas relevant to
the conference theme. Please consult the conference web page for more details.
Two types of submissions are solicited: Long Papers (regular and special sessions) – 8 double-column pages. Work-in-Progress Papers – limited to 4 double-column pages. For further details, please consult the conference web pages.
Deadline for submission of regular and special sessions papers: March 15, 2016
Deadline for submission of work-in-progress papers:                 May 20, 2016
Honorary Chairman
    Reimund Neugebauer,
    President of the Fraunhofer-Society, Germany
General Co-Chairs
    Jürgen Jasperneite,
    Fraunhofer IOSB-INA, Germany
    Richard Zurawski,
    ISA Group, USA
Program Committee Co-Chairs
    Holger Voos,
    Univ. of Luxembourg, Luxembourg
    Roman Obermaisser,
    University of Siegen, Germany
Work-in-Progress Co-Chairs
    Lukasz Wisniewski,
    Institute Industrial IT/OWL University, Germany
    Sebastian Schriegel,
    Fraunhofer IOSB-INA, Germany
Workshops Co-Chairs
    Holger Flatt,
    Fraunhofer IOSB-INA, Germany
    Marek Miskowicz,
    AGH Univ. of Sc. & Tech., Krakow, Poland
Special Sessions Co-Chairs
    Alberto Ortiz,
    Universitat de les Illes Balears, Spain
    Carsten Röcker,
    Institute Industrial IT/OWL University, Germany
Finance Chairmen
    Oliver Niggemann,
    Fraunhofer IOSB-INA, Germany
    Thomas Nolte,
    Mälardalen University, Sweden
Organizing Committee Chair
    Carolin Schönknecht,
    Fraunhofer IOSB-INA, Germany
ETFA2016 Conference Secretary:
Fraunhofer IOSB-INA
Langenbruch 6
32657 Lemgo


International Conference on Embedded Wireless Systems and Networks (EWSN)

International Conference on Embedded Wireless Systems and Networks (EWSN)

15-17 February 2016, Graz, Austria

Call for Posters and Demos

The International Conference on Embedded Wireless Systems and Networks
(EWSN) is a highly selective single-track international conference
focusing on premier research results at the intersection of embedded
systems and wireless networking.

Along with full research papers, EWSN solicits submissions of poster
and demo abstracts whose contribution will be publicly presented
during the conference. The poster session at EWSN will provide a forum
for researchers to present their work in progress and to receive
feedback from experts attending the conference. In parallel to the
poster session, the demo session will offer a unique opportunity to
showcase real prototypes, tools, and systems to the conference

The areas of interest for both poster and demo abstracts are the same
as for full research papers. Please refer to more details.


Demo and poster abstracts must not exceed 2 pages. Titles should start
with “Poster: …” or “Demo: …” depending on the case. Pages must
have 8.5″ x 11″ (letter) two-column format, using 10-point type on
11-point leading, with a maximum text block of 7″ wide x 9″ deep with
an intercolumn spacing of .25″. The page limits include figures,
tables, and references. Submissions may not be anonymous.

A LaTex template is available at under
Calls -> Posters & Demos. At the same page, you find a link where
to perform the actual submission. As we particularly welcome
contributions from students, the submission system offers an option
to explicitly signal whether the main author is a student.

Both poster and demo abstracts may optionally complement the
submission with a video of at most 2 minutes that
further illustrates the work at hand. If the abstract is accepted, the
video will be made available directly from the conference website.

Poster and demo abstracts will be reviewed by at least three members
of the poster/demo committee to ensure quality and matching to the
goals of the poster/demo session as well as to the conference’s
topics. Accepted poster and demo abstracts will be included in
the conference proceedings that appear in the ACM Digital Library.

Presentation at the conference:

In addition to space given to every accepted abstract during the
poster/demo session, one author of the abstract will be given a slot
in a further “1-minute madness” session within the main program. In
this session, authors will have the opportunity to describe their work
to the entire conference audience with a single slide and a 1-minute
speech. Attendees will be given an online link where to cast a vote
for what they think was the best 1-minute poster or demo teaser. Best
poster and demo awards will be decided based on the outcome of the

Important dates:

Submission: December 4th, 2015
Notification: December 18th, 2015

Poster and Demo Chairs:

Olaf Landsiedel (Chalmers University of Technology, Sweden)
Luca Mottola (Luca Mottola, Politecnico di Milano, Italy, and SICS Swedish ICT)

Program Committee:

Yiran Shen (National University of Singapore/MIT Alliance)
Rajib Rana (University of Southern Queensland, Australia)
Chun Liu (Henan University, China)
Junfeng Wu (KTH, Sweden)
Marco Zimmerling (TU Dresden, Germany)
Frederik Hermans (University of Uppsala, Sweden)
Alessandro Sivieri (Politecnico di Milano, Italy)
Zhichao Cao (Tsinghua University, China)
Oana Iova (University of Trento, Italy)
Christoph Sommer (University of Paderborn, Germany)

Penilaian Pengajaran Pensyarah secara Elektronik (ePPP) SESI1-20152016

Dimaklumkan bahawa Penilaian Pengajaran Pensyarah secara Elektronik (ePPP) bagi Semester I Sesi 2015/2016 oleh pelajar-pelajar Prasiswazah dan Pascasiswazah melalui e-PPP sepatutnya bermula pada 22 November 2015 sehingga 19 Disember 2015 ini. Namun, atas keperluan penambahbaikan untuk mendapatkan maklumat mengenai perlaksanaan NALI di UTM dan cuti sempena Hari Keputeraan DYMM Sultan Johor, maka proses penilaian hanya akan bermula pada 24 November 2015 sehingga 19 Disember 2015.


Tarikh: 25 November 2015 (RABU)

Masa: 7.45 pagi

Tempat: Padang UTM Kuala Lumpur

(Warga UTM Kuala Lumpur adalah dimestikan untuk Berpakaian Sukan Lengkap


Seluruh Warga UTM Kuala Lumpur adalah dijemput bersama-sama untuk menyertai program ini.

Untuk makluman, kehadiran staf dalam program ini di kira sebagai jam kredit kursus di dalam UTMSmile.

Semoga hasrat Pengurusan UTM yang ingin memastikan setiap Warga UTM sentiasa membudayakan Gaya Hidup Sihat akan terlaksana. Kerjasama seluruh Warga UTM Kuala Lumpur dalam menjayakan prorgam ini adalah amat dihargai.


The International Conference on Signal Processing and Communications Systems – SPCS 2016


The International Conference on Signal Processing and Communications Systems – SPCS 2016


25 – 27 July, 2016

Lisbon, Portugal

Regular Papers

Paper Submission: February 16, 2016

Authors Notification: May 5, 2016

Camera Ready and Registration: May 19, 2016

Position Papers

Paper Submission: May 2, 2016

Authors Notification: June 6, 2016

Camera Ready and Registration: June 17, 2016



Workshop Proposal: February 26, 2016


Doctoral Consortium

Paper Submission: May 30, 2016

Authors Notification: June 7, 2016

Camera Ready and Registration: June 17, 2016


Special Sessions

Special Session Proposal: March 8, 2016


Tutorials, Demos and Panels Proposals

March 31, 2016


Sponsored by:

INSTICC – Institute for Systems and Technologies of Information, Control and Communication

Sponsored by:

INSTICC – Institute for Systems and Technologies of Information, Control and Communication

INSTICC is Member of:

WfMC – Workflow Management Coalition


In Cooperation with:

ACM – Association for Computing Machinery

SIGAPP – Special Interest Group on Applied Computing


IET – The Institution of Engineering Technology

EURASIP – The European Association for Signal Processing


Logistics Partner:

SCITEVENTS – Science and Technology Events


SPCS is part of PECCS, the 6th International Conference on Pervasive and Embedded Computing and Communication Systems.

Registration to PEC allows free access to all other PECCS conferences.

PECCS 2016 will be held in conjunction with PhyCS 2016.



Siegfried BenknerUniversity of Vienna, Austria
Maria R. EblingIBM T.J. Watson Research Center, United States



All accepted papers will be published in the conference proceedings, under an ISBN reference, on paper and on CD-ROM support.

SCITEPRESS is a member of CrossRef ( and every paper is given a DOI (Digital Object Identifier).

All papers presented at the conference venue will be available at the SCITEPRESS Digital Library.

It is planned to publish a short list of revised and extended versions of presented papers with Springer in a CCIS Series book .

The proceedings will be submitted for indexation by Thomson Reuters Conference Proceedings Citation Index (ISI), INSPEC, DBLP, EI (Elsevier Engineering Village Index) and Scopus.



The awards will be announced and bestowed at the conference closing session.

Please check the websites for further information:



César Benavente-Peces, Universidad Politécnica de Madrid, Spain



Andreas Ahrens, Hochschule Wismar, University of Technology Business and Design, Germany



Each of these topic areas is expanded below but the sub-topics list is not exhaustive. Papers may address one or more of the listed sub-topics, although authors should not feel limited by them. Unlisted but related sub-topics are also acceptable, provided they fit in one of the following main topic areas:




  • Adaptive Systems
  • Detection and Estimation
  • Image and Multidimensional Signal Processing
  • Image Processing
  • Multimedia Communication Systems
  • Time-frequency Analysis
  • Wavelet Signal Processing


  • Adaptive Systems
  • Audio and Speech Signal Processing
  • Detection and Estimation
  • Digital Filter Design and Implementation
  • Multimedia Communication Systems
  • Time-frequency Analysis
  • Wavelet Signal Processing


  • Biomedical Signal Processing
  • Detection and Estimation
  • Remote Sensing and Signal Processing
  • Time-frequency Analysis
  • Biomedical Sensors


  • Antennas and Propagation
  • Channel Measurements and Modeling
  • Coding and Modulation Techniques
  • Communication Systems
  • Diversity Techniques
  • Green communications
  • MIMO – Theory and Trials
  • OFDM Technology
  • Optical Communications and Networks
  • Signal Processing in Communications
  • Space-time cOding
  • Spread Spectrum and CDMA Systems
  • Ultra Wide-Band Communications
  • Wireless and Mobile Networks




SPCS Secretariat

Address: Av. D. Manuel I, 27A, 2º esq.
2910-595 Setúbal – Portugal
Tel.: +351 265 520 184
Fax: +351 265 520 186



ICISE 2016

IEEE Xplore, Ei Compendex – 2016 International Conference on Information Systems Engineering (ICISE 2016)
April 2022, 2016, Los Angeles, USA

All submissions will be peer reviewed, and all the accepted papers will be published in the ICISE 2016 conference Proceedings, and reviewed by the IEEE Conference Publication Program for IEEE Xplore and Ei Compendex.

Keynote Speakers
-Prof. Rory McGreal
UNESCO/COL Chair in OER, Athabasca University, Canada
-Prof. Dr. Houssain Kettani
Fort Hays State University, USA

Honorary Chairs
Dr. Francisco E. Rivera, Federal Aviation Administration (FAA), USA
International Advisory Committees
Prof. Rory Mc Greal, Athabasca University, Canada
Conference Co-Chairs
Dr. Houssain Kettani, Fort Hays State University, USA
Prof. Feng C. Lai, University of Oklahoma, USA
Prof. Anu Gokhale, Illinois State University, USA

Contact us
Ms. Sasha Pan,


ACM ToDAES special section

ACM ToDAES special section – Call for Papers
IDEA: Integrating Dataflow, Embedded computing, and Architecture

Special Section Guest Editors:
Twan Basten (Eindhoven University of Technology), Orlando Moreira (Intel), Robert de Groote (Twente University)

Important Dates:
January 8, 2016 – Paper submission deadline
March 4, 2016 – First round of reviews complete, notification of authors
May 1, 2016 – Submission of revised versions
June 15, 2016 – Second round of reviews complete, final acceptance notifications
– Summer/Fall 2016 – Final versions due and special section publication

The dataflow model of computation (with SDF, CSDF, and DDF as primary representatives) offers a powerful perspective on parallel computations that may be conditioned in terms of data dependencies. It dates back to the nineteen sixties and has applications in the design of real-time stream-processing systems, especially in the area of digital signal processing. The dataflow model of computation fits the characteristics of embedded and cyber-physical systems, with a strong emphasis on both the functional and temporal aspects of data processing systems. Dataflow is gaining renewed popularity, stimulated by the trend towards multi-core and multi-processor architectures, with an influx of work ranging from using dataflow as a programming paradigm, for performance analysis, or for design optimization. Topics of interest for the special section include, but are not limited to:

  • Dataflow architectures and dataflow as a programming paradigm for multi-core and multi-processor systems, for embedded systems and for cyber-physical systems.
  • Tools for compilation, evaluation, optimization or synthesis of applications for heterogeneous and homogeneous multi-processor systems.
  • Real-time scheduling, analysis, response time modeling, schedule synthesis. Variants of the dataflow model of computation, capturing e.g. dynamic execution behavior, stochastic dataflow.
  • Dataflow theory, relations between dataflow and other models of computation, relations between dataflow variants.
  • Dataflow in multi-disciplinary design, applications of dataflow in control, integrating dataflow and control theory.
  • Case studies of general interest describing the application of dataflow in embedded computing and cyber-physical systems, ranging from automotive systems, and avionics, to high-tech systems, smart buildings and smart grids.

Submission Guidelines:
Submissions should follow the usual ToDAES guidelines. Submissions go through When asked “Is this manuscript a candidate for a special issue?”, mark “Yes” to ensure that the paper is allocated to the guest editors of the special section.

IDEA 2016 workshop @ CPS week:
To further stimulate discussion in the dataflow community, we are organizing a workshop at CPS week in Vienna, April 11, 2016. Authors of papers submitted to the IDEA ToDAES special section that successfully pass the first round of reviews are invited to present their work at the workshop. Participation in the workshop will increase the visibility of the presented work and increase quality through the discussion at the workshop. See for more information about the workshop, including information on how to express interest to present the submitted work. Presentation and discussion at the workshop is optional and will not in any way influence acceptance for the special section.

ICCAR 2016

IEEE 2016 The 2nd International Conference on Control, Automation and Robotics (ICCAR 2016)
Hong Kong, April 2830, 2016.
Conference official website:

ICCAR 2016 conference proceedings will be published by IEEE Conference Publication, which would be indexed by <<IEEE Xplore and Ei Compendex>>.

ICCAR 2016 is in the IEEE conference list.®ION=ALL&COUNTRY=ALL&RowsPerPage=10&PageLinkNum=10&ActivePage=1&SORTORDER=desc&SORTFIELD=start_date

Publication and Indexing History of ICCAR:
ICCAR 2015, Singapore, May 20-22, 2015.
Publication: IEEE Conference Proceedings

Keynote and Plenary Speakers
Prof. Wei-Hsin Liao, The Chinese University of Hong Kong. Excellent editor of SPIE, IEEE fellow
Prof. Felix T. S. Chan, The Hong Kong Polytechnic University.
Prof. Maode Ma, Nanyang Technological University, Singapore. IEEE senior editor, IEEE fellow
Dr. GirijaChetty University Of Canberra, Canberra, Australia

Cindy Lau/ +1-562-606-1057/


2016 2nd International Conference on Innovations in Communications, Network Systems and Computer Science (ICNSCS-16)
10th to 11th January 2016
Dubai, United Arab Emirates

New Abstract/Poster/Full Paper Submission Deadline: Nov. 25, 2015 (Early Bird updated)

Author Student USD 165
Academician (IAE Member) USD 150
Academician (Non IAE Member) USD 175
CO-Author/Listener USD 150

ISBN Proceedings will be submitted to CNKI, Google Scholar, Google, DOAJ, Citeseer for Indexing. Each Paper will be assigned Digital Object Identifier(DOI) from CROSSREF. The Printed Proceedings will be published with ISBN Numbers.

Abstracts/Posters/FULL Research Papers are welcomed from the following and related areas:
-Artificial Intelligence and Machine Learning
-Computer Graphics, Simulation and Modeling
-Computational Intelligence
-Computer Science & Engineering
-Communication Engineering
-Data Mining, Management and Storage
-Information Technology
-Network and Network Systems
-Signal and Image Processing
-Systems Engineering
-Software Engineering

Via Email:

Web address:
Sponsored by: IACITE

Payment Method*
1. Online payment with PAYPAL using debit/credit card (
2. Pay by Bank Transfer
* The link for Credit Card payment and the Bank Information can be found in the registration form

Holiday Inn Dubai – Downtown Dubai
Al Rigga Street, Dubai, United Arab Emirates

International Workshop on Early Reliability Modeling for Aging and Variability in Silicon Systems

International Workshop on Early Reliability Modeling for Aging and Variability in Silicon Systems  (ERMAVSS)

Submission details at the bottom of this e_mail.Website :

Friday, March 18th 2016. Co-located with DATE (Design, Automation and Test in Europe) in Dresden, Germany.

Important Dates:

Submission Deadline :             December 4th 2015
Notification of Acceptance :    December 14th 2015
Final paper due :                       January 29th 2016

About the Workshop:

With the proliferation of integrated circuits implemented in the most advanced process technologies, there is a growing need to jointly analyze the effect of multiple sources of failures including variability and aging and to understand, early in the design cycle, their impact on system reliability. Today, conservative margins are required to ensure that devices operate correctly over their full lifetime, despite the impact of aging effects (BTI, HCI) and failure mechanisms such as EM. New methodologies for improved cross-layer modeling and mitigation, if planned early in the design of a product, have the potential to remove unnecessary conservatism, reduce power and cost and improve yield. This workshop is focused on sharing new research on techniques and methodologies for modeling the effects of failures due to transistor aging, variability and other mechanisms all the way from the cell level to system level. New approaches to perform early estimations of system reliability are much needed to enabling reliable, optimized and low-power designs.

Authors are invited to submit a 2-4 page short paper (using the standard IEEE two-column conference format) on topics related to:

  • Early reliability modeling for complex silicon devices
  • Advanced Modeling of degradation effects (HCI, xBTI, EM) and variability
  • EDA flows and design tools for analyzing the effects of variability and aging
  • Assessment of semiconductor degradation and failure effects on embedded and safety critical systems
  • Modeling of the effects of environment, mission profile and workload on reliability

Submisssion Details

Papers can be submitted at in pdf format.