Served as the main supervisor (Year of graduation)
Ph.D. Supervision
- Mahzan Johar (2019)
Mechanics of Adhesive Joints With Continuously Degrading Performance - Mohammad Amirul Affiz Afripin (2019)
Development of Damage Mechanics-Based Model for Reliability Assessment of Through Silicon Vias (TSV) Interconnects - Muhammad A’imullah Abdullah (2018)
Mode-II Damage Evolution of CFRP Laminated Composites under High Cycle Fatigue Loading - Ismail Abu Shah (2017)
Mechanics-Of-Deformation Approach In Failure Prediction Of Draw Forming Processes - Seyed Saeid Rahimian Koloor (2016)
Validated Simulation Methodology for Fracture Processes of Composite Laminates using Damages-Based Models - Abdoulhdi Amhmad Borhana (2014)
Damage Mechanics-Based Failure Model For Sheet Metals Under Large Plastic Deformation - Wong King Jye (2013)
Moisture Absorption Characteristics and Effects on Mechanical Behavior of CFRP Composite Laminates
(UTM – Institut Supérieur de l’automobile et des Transports (ISAT) Doctoral Join-Supervision Program, Nevers, France). - Norhashimah binti Mohd Shaffiar (2012)
Integration of Damage-Based Models For Fatigue of Solder Interconnects - Fethma M.Nor (2012)
Mechanics of Damage and Fracture Process in Unidirectional CFRP Composite Laminates
(UTM-Dongguk University Doctoral Join-Supervision Program, Korea) - Hassan Osman Ali Mohammed (2010)
Creep-rupture Behavior of AISI347 Austenitic Stainless Steel Foils at Different Temperature and Stress Levels - Muhammad Adil Khattak (2009)
Effects of Absorbed Hydrogen and Thermal Exposure on Mechanical Properties and Crack Propagation of Welded Steel
M.Eng Supervision
- Aliff Farhan bin Yamin (2013)
Dynamic Fracture Process of Solder/Intermetallic in Lead-Free Solder Interconnects Using Cohesive Zone Model - Hina Muhammad Ismail (2013)
Large Deformation of Thin-walled Tubular Structure - Lai Zheng Bo (2010)
Classical and Damage Mechanic-Based Models For Lead-Free Solder Interconnects - Fethma binti M. Nor (2009)
Mechanics of Solder Joints and Solder/Intermettalic Interface Under Temperature and Mechanical Loading - Pang Hooi San (2007)
Characterization of Low CTE Substrate Materials for Microelectronic Packages - Liew Yek Ban (2006)
Methodology for Failure Assessment of Microelectronic Packages due to Temperature Cycles - Mohamad Sukri Mustapa (2001)
Effects of Load Parameters on Fatigue Crack Growth Behavior of Stainless Steel 316 - Koh Yee Kan (2004)
A Unified Constitutive Model for Solder Joint Materials - Oknovia Susanti (2004)
Mechanical Characterization of As-Cast and Heat-Treated Ti-48Al Intermetallic Alloys - Ng Chee Weng (2005)
Mechanism-based Reliability Model for Electronic Packages - Abdul Halim Abdullah (2008)
Effects of Stem Length and Tapered Prosthesis on Stress Distribution in Cemented Total Hip Replacement
SUPERVISION OF POST-DOCTORAL FELLOWS AND INTERNS
Post-doctoral Fellows
July 2017- July 2019 : Dr. Seyed Saeid Rahimian Koloor
Advanced Testing of Laminated Composites for Aerospace Parts and Assemblies
Aug 2013 – July 2014 : Dr. Moones Rhmandoust
P1 – Design and construction of efficient body structure for electric vehicle
P2- Temperature- and rate-dependent parameters for damage-based fatigue models of Pb-free solders
Internship Students
Sep 2018 – Feb 2019 : Tomoisa Mikami, Tokyo University of Agriculture and Technology (TUAT), Japan, 2nd Year, Intern
Mechanics of Cohesive Interfaces in Fiber-reinforced Polymer Composite Laminates
20-week (equivalent to 6-credit FYP), at the Computational Solid Mechanic Laboratory (CSMLab), UTM
Sep 2017 – Feb 2018 : Kota Takamoto, Tokyo University of Agriculture and Technology (TUAT), Japan, 3nd Year, Intern
Flexural Responses of CFRP Composite Laminates by FE Simulations.
Placement at the Computational Solid Mechanic Laboratory (CSMLab), UTM
May – July 2007 : Anita Anusic, University of Nurnburg, Germany, 3rd year, Intern
Development of Finite Element Model for Surface Mount Assembly
12-week at the Computational Solid Mechanic Laboratory (CSMLab) UTM
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