http://www.tencon2016.org

TENCON is a premier international technical conference of IEEE Region 10, which comprises 57 Sections, 6 Councils, 21 Subsections, 514 Chapters and 1159 Student Branches in the Asia Pacific region. The theme for TENCON 2016 is Technologies for Smart Nation and it will be held in Singapore from 22 – 25 November 2016 at Marina Bay Sands.

Organizers are inviting special session proposals within the scope of TENCON 2016. Organizers also invite VOLUNTEERS to serve as reviewers or as track chairs. If you are willing to assist as a special session organizer or track chair or reviewer, please inform us by sending an email to:
elelwt@nus.edu.sg  , epnsugan@ntu.edu.sg,
elesahoo@nus.edu.sg,emdma@ntu.edu.sg
Reviewers: 2 years of research or industrial experience
Special session & Track Chairs: postdocs with good experience and above, etc.

This conference is expected to bring together researchers, educators, students, practitioners, technocrats and policymakers from across academia, government, industry and non-governmental organizations to discuss, share and promote current works and recent accomplishments across all aspects of electrical, electronic and computer engineering, as well as information technology. Distinguished people will be invited to deliver keynote speeches and invited talks on trends and significant advances in the emerging technologies. IEEE President Barry Shoop will be one of the keynote speakers.

The online electronic paper submission is open from March 1, 2016. The scope of conference papers and exhibits include but are not limited to the following areas:

• Power Generation, Transmission and Distribution
• Power Electronics
• Wireless Power Transfer and Energy Harvesting
• Renewable Energy Sources and Technology
• Signal and Image Processing
• Antennas, Propagation and Computational EM
• Analog and Mixed Signal ICs
• RF/Millimeter-wave Circuits and Systems
• Smart Nation and Internet of Things
• Robotics, Control, Instrumentation and Automation
• 3D Printing/Flexible Electronics
• Electronic Devices & Materials Processing
• Nano-electronics
• Wireless Communications and Networks
• Computing Architectures and Systems
• Network and Cyber-Security
• Photonic Technologies
• Computational Intelligence
• Big Data Analytics
• Humanitarian Technologies
• Aerospace Technology
• Marine and Offshore Engineering

TENCON 2016 will feature both invited and contributed papers. The best papers will be selected from the contributed papers for awards. The presented papers will be submitted to IEEE Xplore, which is indexed by major databases. Prospective authors are invited to submit full papers with three to four pages, in double column IEEE Conference format.

Important Dates
Paper Submission Deadline/Link 30 May 2016 www.tencon2016.org

Notice of Acceptance:  1 August 2016
Final Manuscripts:  10 September 2016

For more information, please contact:
TENCON 2016 Secretariat
Jasmine Leong
IEEE Singapore Section
Tel:  +65 6743 2523
sec.singapore@ieee.org
http://www.tencon2016.org

Call for Papers
2016 INTERNATIONAL CONFERENCE ON ELECTRICAL ELECTRONIC COMMUNICATION AND CONTROL 

 
Date: 18 & 19 December 2016
Venue: Faculty of Electrical Engineering, Universiti Teknologi Malaysia, Johor Bahru

Official website: 
http://www.fke.utm.my/ICEECC2016/

Conference Aims

ICEECC 2016 aims to bring together researches, academicians, doctoral students and practitioners to exchange and share their experiences, new ideas, and research results about in Electrical Engineering research work.
Topics

Potential participants are invited to submit their full papers in any of the following areas (but not limited to):

1. Electrical Power Engineering

• Power Generation, Transmission and Distribution
• Power Quality and Grounding
• Distribution System Planning and Reliability
• Flexible AC Transmission Systems
• Renewable Energy Sources
• Energy Storage
• Smart-grids Technologies & Applications
• Power Electronics
• Electrical Machines and Adjustable Speed Drives
• High Voltage Engineering and Insulation Technology

2. Electronic and Computer Engineering

• Nanotechnology
• Semiconductor Technology
• VLSI Circuit Design
• Digital Signal Processing
• Computer Vision, Image and Video Processing
• Embedded Systems and Hardware
• Analog and Digital IC Testing and Design
• Biomedical Instrumentation and Electronics
• Microcontroller and Microprocessor Systems
• Multimedia and Network

3. Control and Mechatronic Engineering

• Optimal Control & Optimization
• Sensors & Actuators
• Micro-electromechanical Systems (MEMS)
• Identification & Estimation
• Industrial Process Control and Automation
• Computer Integrated Manufacturing (CIM)
• Artificial Intelligence & Soft Computing
• Mechatronics & Robotics
• Real-time & Embedded Systems
• Automotive Control

4. Communication Engineering

• Acoustic and Sensor technology
• RF/Microwave Circuit and System
• Optical Devices, Sensor, Network and Communication
• Wireless Sensor Network, Protocol, Cross layer
• 4G/5G Technology
• Satellite & Mobile Communication
• Radar and Sonar Technology
• Internet of Things (IoT)
• Cognitive Radio
• Antenna, Propagation and SAR

Manuscripts Submission

All submissions are to be made via EDAS submission system. Please visit conference website for submission details.

Important Dates

Full paper Submission Deadline: 31^st July 2016

Notification of Acceptance: 30^th September 2016

Final Paper Submission Deadline: 15^th October 2016

Registration Deadline for Authors: 15^th November 2016

Publication Opportunities
Accepted and registered papers  will be published in SCOPUS indexed.

We look forward to seeing you in December 2016.

Sincerely,

Secretariat ICEECC2016

http://www.ieeesingapore.net/#!tencon-2016/c1v20

TENCON is a premier international technical conference of IEEE Region 10, which comprises 57 Sections, 6 Councils, 21 Subsections, 514 Chapters and 1159 Student Branches in the Asia Pacific region. The theme for TENCON 2016 is Future Technologies for Smart Nation and it will be held in Singapore from 22-25 November, 2016.

This conference is expected to bring together researchers, educators, students, practitioners, technocrats and policymakers from across academia, government, industry and non-governmental organizations to discuss, share and promote current works and recent accomplishments across all aspects of electrical, electronic and computer engineering, & information technology. Distinguished people will be invited to deliver keynote speeches and invited talks on trends and significant advances in the emerging technologies.

The online electronic paper submission will open from March 1, 2016. The scope of conference papers and exhibits include but not limited to the following areas:

• Power Generation, Transmission and Distribution

• Power Electronics

• Wireless Power Transfer and Energy Harvesting

• Renewable Energy Sources and Technology

• Signal and Image Processing

• Antennas, Propagation and Computational EM

• Analog and Mixed Signal ICs

• RF/Millimeter-wave Circuits and Systems

• Smart Nation and Internet of Things

• Robotics, Control, Instrumentation and Automation

• 3D Printing/Flexible Electronics

• Electronic Devices & Materials Processing

• Nano-electronics

• Wireless Communications and Networks

• Computing Architectures and Systems

• Network and Cyber-Security

• Photonic Technologies

• Computational Intelligence

• Big Data Analytics

• Humanitarian Technologies

• Aerospace Technologies

• Marine and Offshore Engineering

The IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) is the oldest circuits and systems symposium sponsored by the IEEE. The 59^th edition (MWSCAS 2016) will be held in Abu Dhabi, United Arab Emirates, at the Hotel Fairmont Bab Al Bahr between 16-19 October 2016.

MWSCAS 2016 will include oral and poster sessions, student paper contest, tutorials given by experts in circuits and systems topics, and special sessions.
Topics include, but are not limited to:

• Analog and Mixed Signal Integrated Circuits
• Neuromorphic Systems
• Digital Integrated Circuits, SOC, and NOC
• Control Systems, Mechatronics, and Robotics
• Systems on chip for IoTs
• Linear and Non-linear Circuits and Systems
• Power Systems and Power Electronics
• Nanoelectronics and Nanotechnology
• Bioengineering Systems and Bio Chips
• Communication and Wireless Systems
• System Architectures
• Embedded Electronics
• Image Processing and Multimedia Systems
• MEMS/NEMS
• RFICs, Microwave, and Optical Systems
• Digital Signal Processing
• Power Management and Energy Harvesting
• Hardware/Software Co-design
• Bio-inspired Green Technologies

Prospective authors are invited to submit a full paper (4 pages) describing original work. Only electronic submissions will be accepted, through the online submission system. Papers should follow the formatting instructions in the authors’ kit. Papers will be accepted for either lecture or poster presentation. Both formats have the same value, and presentation method will be chosen for suitability. Students are encouraged to participate in the Best Student Paper Award contest. We also encourage submissions of proposals for tutorials and special sessions. Accepted papers will be published on the MWSCAS2016 Proceedings subject to advance registration of at least one of the authors at the author rate. All papers published in the MWSCAS2016 Proceedings will be submitted into IEEE Xplore.

CALL FOR PAPERS AND PROPOSALS
2016 IEEE 3rd World Forum on Internet of Things (WF-IoT)
12-14 December 2016 – Reston, VA, USA
http://www.ieee-wf-iot.org

IoT: Smart Innovation for Vibrant Ecosystems

The 2016 IEEE 3rd World Forum on Internet of Things (WF-IoT) seeks contributions on how to nurture and cultivate IoT technologies and applications for the benefit of society. Original papers are solicited in, but are not limited to, the following topics:

IoT Enabling Technologies

* 5G Networks and IoT
* Software Defined Network (SDN) and IoT
* Sensor and Actuator Networks
* Ultra-low power IoT Technologies and Embedded Systems Architectures
* Wearables, Body Sensor Networks, Smart Portable Devices
* Design Space Exploration Techniques for IoT Devices and Systems
* Heterogeneous Networks, Web of Things, Web of Everything
* IoT Protocols (IPv6, 6LoWPAN, RPL, 6TiSCH, W3C)
* Named Data Networking for IoT
* Internet of Nano Things
* Sensors Data Management, IoT Mining and Analytics
* Adaptive Systems and Models at Runtime
* Distributed Storage, Data Fusion
* Routing and Control Protocols
* Resource Management, Access Control
* Mobility, Localization and Management Aspects
* Identity Management and Object Recognition
* Localization Technologies
* Edge Computing, Fog Computing and IoT
* Machine to Machine (M2M)/Devices-to-Devices communications and IoT
* Industrial IoT and Factory of Things and Internet of Things

IoT Application and Services

* Cyber-physical systems, Context Awareness, Situation Awareness, Ambient Intelligence
* Collaborative Applications and Systems
* Service Experiences and Analysis
* Smart Cities, Smart Public Places, Smart Home/Building Automation
* e-Health, e-Wellness, Automotive, Intelligent Transport
* Smart Grid, Energy Management
* Consumer Electronics, Assisted Living, Rural Services and Production
* Industrial IoT Service Creation and Management Aspects
* Crowd-sensing, human centric sensing
* Big data and IoT Data Analytics
* Internet Applications Naming and Identifiers
* Semantic Technologies, Collective Intelligence
* Cognitive and Reasoning about Things and Smart Objects
* Mobile Cloud Computing (MCC) and IoT
* Horizontal application development for IoT
* Design principals and best practices for IoT application development
* IoT Multimedia

IoT Societal Impacts

* Human Role in the IoT, Social Aspects and Services
* Value Chain Analysis and Evolution Aspects
* New Human-Device Interactions for IoT, Do-It-Yourself
* Social Models and Networks
* Green IoT: Sustainable Design and Technologies
* Urban Dynamics and crowdsourcing services
* Metrics, Measurements, and Evaluation of IoT Sustainability and ROI

Security and Privacy for Internet of Things

* IoT Privacy and Security Concerns
* Identification and authentication issues
* Wireless sensor network for IoT security
* Intrusion detection in IoT
* Cryptography, key management and authorization for IoT
* Physical/MAC/Network Attacks in Internet of Things
* Cross-layer attacks in IoT
* Security with QoS optimization in IoT
* Privacy based channel access in IoT
* IoT forensic science
* Big data and information integrity in IoT
* Communication security in IoT
* Security standards in IoT

IoT Experimental Results and Deployment Scenarios

* Closing the Gap between Research and Implementation
* Experimental prototypes, Test-Bed and Field Trial Experiences
* Multi-Objective IoT System Modeling and Analysis-Performance, Energy, Reliability, Robustness
* IoT Interconnections Analysis-QoS, Scalability, Performance, Interference
* Real case deployment scenarios and results
* IoT deployment at Government and ISPs
* IoT deployment on agriculture, retails, smart cities, etc.
* IoT Interconnections among ISPs Analysis-QoS, Scalability, Performance, Interference
* Gaps Analysis for real deployment
* IoT and Future Internet architectures
* Standardization and Regulation

Paper Submissions and Publications
The 3rd IEEE World Forum on Internet of Things (WF-IoT 2016) solicits two types of submissions.
Full papers describing original research. Suggested size is four pages; papers up to six pages will be accepted. Papers will be fully peer reviewed and, if accepted, included in conference proceedings and will be submitted to the Xplore Digital Library. Extended versions of selected papers may be considered for publication in IEEE IoT Journal.

Extended abstracts describing emerging results of new research areas or relevant topics from an industrial point of view, not to exceed two pages.

Important Dates for Paper Submissions
Manuscripts Due: June 15, 2016
Acceptance Notification: September 30, 2016
Camera-Ready Submission: October 31, 2016
Papers must be submitted electronically: https://edas.info/22145

Contacts for Papers:
TPC General Chair: Prof. Antonio Skarmeta, University of Murcia, Spain skarmeta@um.es
TPC Co-Chairs: Prof. Philip Hall, The University of Melbourne, Australia philip.hall@ieee.org and Dr. Yu Rongshan, Institute for Infocomm Research, Singapore rongshanyu@ieee.org

Website: http://www.ieee-wf-iot.org/

Tutorial, Workshops and Special Session Submissions
Tutorial proposals should contain an abstract, scope, intended audience, objectives, prior history, an outline, the biographical sketch of presenters and any other information that may assist in making decisions. Special Sessions should complement the regular program with new and emerging topics of interest. Proposals must be in the form of a single PDF file not to exceed four pages.

Important Dates for Tutorial, Doctoral Symposia and Special Session Submissions
Proposals due Tutorials: July 25, 2016
Proposals due Special Session and Workshops: April 30, 2016

Proposals must be submitted electronically: https://edas.info/22145

Contacts for Tutorials and Doctoral Symposium:
Prof. Hausi Muller, University of Victoria, Canada hausi@cs.uvic.ca
Dr. Dave Cavalcanti, Intel, USA dave.cavalcanti@intel.com
Prof. Vincenzo Piuri, University of Milan, Italy vincenzo.piuri@unimi.it

Contacts for Special Sessions and Workshops:
Dr. Mirko Presser, Alexandra Instituttet A/S, Denmark mirko.presser@alexandra.dk
Soumya Kanti Datta, Eurecom, France soumya-kanti.datta@eurecom.fr

Industry Forum Panel Sessions Submissions
The 2016 IEEE 3rd World Forum on Internet of Things (WF-IoT) will be hosting Industry Forum Panel Sessions. Presentation in Industrial Forum will be panelist based and panel presentation material will not be published in conference proceedings but will be available in the conference web site. Industrial Forum Panel proposal should contain an abstract, scope, intended audience, objectives, prior history, an outline, the biographical sketch of presenters and any other information that may assist in making decisions.

Important Dates for Industry Panel Proposal
Proposal deadline: July 25 2016
Proposals must be submitted electronically: https://edas.info/22145
Contact for Industry panels:
Kazunori Iwasa, Fujitsu, kiwasa@jp.fujitsu.com
Yoshihiro Ohba, Toshiba, yoshihiro.ohba@toshiba.co.jp

Conference Organization
General Chair: Geoff Mulligan, Founder & President, IPSO Alliance, USA
Co-Chair: Latif Ladid, Research Fellow, SnT, University of Luxembourg, Luxembourg
Former Chair: Dr. Roberto Minerva, IEEE IoT Initiative Chair, Telecom Italia, Italy
Co-Chair: Prof. Vincenzo Piuri, University of Milan, Italy
Co-Chair: Dr. Katrin Reitsma, Motorola Solutions, USA,
Industrial Co-Chair: Kazunori Iwasa, Fujitsu, Japan

Financially Co-Sponsored by
IEEE Communications Society
IEEE Computer Society
IEEE Consumer Electronics Society
IEEE Reliability Society
IEEE Sensors Council
IEEE Signal Processing Society
IEEE Society on Social Implications of Technology
IEEE Council on Electric Design Automation
IEEE Vehicular Technology Society

For full details, visit our website: http://www.ieee-wf-iot.org

============================================================
IEEE Vehicular Technology
IEEE Consumer Electronics Society

ISSN: 2289-2370

Open International Journal of Informatics (OIJI) is an international peer-reviewed journal (Open Access) dedicated to the latest advancement of Informatics sponsored by Advanced Informatics School (AIS) UTM, Kuala Lumpur Campus. The goal of this journal is to provide a platform for scientists, researchers and academicians all over the world to promote, share, and discuss various new issues and developments in broad areas of Informatics.

We welcome submission of papers that present theoretical and application of Informatics but not limited to:

• Big Data Analytics
• Software Engineering
• Visual Engineering
• Systems Engineering
• Information Systems
• Information Security
• Forensic and Social Engineering
• Computer Ethics and Privacy
• Artificial Intelligence
• Intelligent Systems and Computing Technologies
• Machine Learning, Evolutionary Programs and Neural Networks
• Image, Speech and Signal Computing
• Informatics related discipline (e.g. Agro-based, Business, Health, Sports, Social, etc)

Types of Manuscript

• Regular articles: These should describe new and carefully confirmed findings, and experimental procedures should be given in sufficient detail for others to verify the work. The length of a full papershould be the minimum required to describe and interpret the work clearly. Regular articles are about 8 to 20 manuscript pages in length.
• Short Communications: A Short Communication is suitable for recording the results of complete small investigations or giving details of new models or hypotheses, innovative methods, techniques or apparatus. The style of main sections need not conform to that of full-length papers. Short communications are about 4 to 8 manuscript pages in length.
• Reviews: Submissions of reviews and perspectives covering topics of current interest are welcome and encouraged. Reviews should be concise and about 8 to 15 manuscript pages. Reviews manuscripts are also peer-reviewed.

Important Dates

• Submission of Full paper: 30 May 2016
• Notification of Acceptance: 7 June 2016
• Camera ready: 30 June 2016

Expression of Interest Deadline: February 17, 2016

The IEEE Circuits and Systems Society (CASS) is soliciting proposals for the organization of its flagship conference, the International Symposium for Circuits and Systems (ISCAS) for the year 2020. According to the established regional rotation schedule, ISCAS 2020 is open to all regions.

At this time, we are soliciting an Expression of Interest.
The Expression of Interest needs to include the following information:
1. The General Chair name and Key Committee members with their resume and their current or past involvement in CASS leadership and CASS conferences
2. Sponsoring IEEE OUs and other organizations besides CASS
3. Lead Contact for local hosts and contact details
4. Proposed destination and venue
5. Estimated budget
6. A letter of commitment from the General Chair to present the proposal in person at ISCAS 2016 if the letter of intent is accepted

The Expression of Interest may not exceed 3 pages (the General Chair/Key Committee members resumes are not included in the 3 page maximum). Submit the Expression of Interest electronically to Amara Amara, IEEE CASS Vice President of Conferences, atamara.amara@isep.fr with a copy to IEEE CASS Administrator, Brittian Gimbel, atmanager@ieee-cas.org by February 17, 2016.

Proposers will receive notification by March 4, 2016 if their Expression of Interest is accepted. The accepted proposers will then be invited to submit the final ISCAS bid packet, the final bid submission will be due on April 22, 2016.

All information on ISCAS and the Call for Proposal procedure is outlined in the ISCAS Organizing Guide on the CAS website: http://ieee-cas.org/conferences/guidelines-to-iscas-organizers. It is very important that you review this guide thoroughly and carefully before submitting your Expression of Interest.

If you have any questions, please contact the CASS Administrator at manager@ieee-cas.org.

Dear Professors and colleagues,